the A20 maxes out at 2.5 watts: we know that there’s no heatsink needed. the space is so tight that the SoC is in direct contact with the stainless steel case, which is in turn in direct contact with the aluminium from the keyboard.
at around 3.5 watts we can use the exact same graphite heatspreader paper that’s used in mobile phones. graphite has extraordinarily high thermal conductivity. at up to 4.5 watts we can flood the case with thermal gel and seal it.
when they stop doing processors with the spying backdoor co-processor… yes
and MIPS. i can live with chrome, android, FreeBSD, l4linux, l4android and so on.
that’s why i re-used PCMCIA because it’s designed for continuous insert/remove. the manufacturers typically quote something like 25,000 insertions during testing.
[quote] and which will take up more space than a traditional motherboard.
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lucky this isn’t a traditional motherboard, then, eh?
[quote] People want thin and light, but modularity necessarily adds thickness and weight.
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that’s why i’m not focussing on the smartphone market… yet. the laptop’s around 22mm thick, which is pretty damn good for a 15.6in. the microdesktop is about the same.
the computer cards are 40 grams, and the laptop’s 1.1kg. weight’s not as much of a problem when you go ultra-low-power, as you get mass decompounding. no heatsinks, no heat pipes, no hard drives… all that weight falls away.
i’ve been at this for 5 years, chipandre - i’ve had time to think about these things, and how to get there based on the available budget.